Subtractive photonics

Realization of a multilayer photonic process, as well co-integration large number and electronic components on single substrate, presents many advantages over conventional solutions opens pathway for various novel architectures applications. Despite the potential advantages, realization complex process compatible with low-cost CMOS platforms remains challenging. In this paper, platform is investigated that uses subtractively manufactured structures to fabricate such systems. These are created solely using simple post-processing methods, no modification foundry process. This method well-controlled metal layers advanced integrated electronics sacrificial define dielectric shapes optical components. Metal patterns removed an etching leaving behind system, while keeping electronics'metal wiring intact. approach can be applied any chip well-defined metallization, including those produced in pure processes, photonics heterogeneously monolithic electronic-photonic etc. paper provides proof-of-concept example integration 65 nm bulk demonstrates structures. The fabrication results, characterization, measurement data presented.